Electronic sphygmomanometer pressure sensor

1. Design and produce wafers using our U.S. invention patent SENSA process technology; 2. The wafer has high consistency and is divided into 6 gears according to offset and span. 3. The concentration of temperature characteristics is good, and the change of temperature range from 5 to 45 degrees is within 2mmHg. 4. Nonlinearity, pressure hysteresis and temperature hysteresis are all within 3 ‰. 5. Our company reuses the silicon wheat industry chain, which is localized in the whole industry chain and has high cost performance ratio.
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Barometer

The barometer product adopts a unique LGA package form, which has been verified for a long time and is stable and reliable. High stability atmospheric pressure measurement device, can provide accurate, and external sensing pressure linear correlation of digital signal output
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Silicon Microphone

MEMS microphone has the advantages of high reliability, high stability, high consistency, low defect rate and low repair rate. The capacitive silicon microphone chip mainly includes a thin and elastic diaphragm and a rigid back plate, the back plate and the diaphragm form a parallel plate capacitor; the diaphragm will be displaced under the action of sound pressure, and the plate voltage will change with the movement of the diaphragm, thus converting the acoustic signal into an electrical signal.
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Bone vibration sensor

The vibration signal generated by the vocal cords is transmitted in two ways: one is to spread outward through the air medium, and the other is to spread outward through the human brain bone and muscle, causing the vibration of the auricle. The bone vibration sensor is to use the latter mode of transmission to detect the vibration signal of the auricle and pick up the wearer's voice information. The bone vibration sensor is not sensitive to the sound wave signal transmitted in the air, and has a natural suppression effect on the sound signal transmitted in the air. Therefore, the call noise reduction algorithm is simpler and more natural, and the noise suppression is more effective, which can provide better uplink call effect
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HK1003 two-wire interface digital temperature sensor

HK1003 is a low power digital temperature sensor in a 4-bump Wafer Level Chip Scale Package (WLCSP). HK1003 has a two-wire interface compatible with I2C and SMBus interfaces. At the same time, the interface also supports multi-device access (MDA) commands, allowing the master controller to communicate with multiple devices on the bus at the same time. When multiple devices need to be HK1003 is a very good choice when monitoring the temperature measurement area, and the measurement area is limited in space and sensitive to power consumption.
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HK1075 I²C Interface Digital Temperature Sensor and Monitor

HK1075 is a digital temperature sensor with built-in band gap temperature detector and 11-bit analog-to-digital converter, and also provides overheating warning function. Supports two working modes: normal working and low power consumption. HK1075 communicates with the controller through a two-wire serial I2C bus interface. HK1075 also contains an overheat detection output pin (OS), which is effective when the temperature exceeds the programmed limit temperature value. The I2C bus part and the ADC conversion part in HK1075 are completely independent, and accessing the device does not affect the conversion process.
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