Electronic sphygmomanometer pressure sensor
Category:
1. Design and produce wafers using our U.S. invention patent SENSA process technology; 2. The wafer has high consistency and is divided into 6 gears according to offset and span. 3. The concentration of temperature characteristics is good, and the change of temperature range from 5 to 45 degrees is within 2mmHg. 4. Nonlinearity, pressure hysteresis and temperature hysteresis are all within 3 ‰. 5. Our company reuses the silicon wheat industry chain, which is localized in the whole industry chain and has high cost performance ratio.
Key words:
MEMS pressure sensor
Product Details
1, the use of our U.S. invention patent SENSA process technology design and production of wafers;
2. The wafer has high consistency and is divided into 6 gears according to offset and span;
3, the temperature characteristics of the concentration is good, 5 to 45 degrees of full temperature change within 2mmHg;
4, nonlinear, pressure hysteresis, temperature hysteresis are within 3;
5, reuse our silicon wheat industry chain, the whole industry chain localization, cost-effective.
Product Type:
| Product Model | Product promotion status | Key Market Applications | Output Type | Output range (V) | Pressure type | Pressure range (kPA) | Encapsulation form | Product size (length * width * height/m) | Working temperature (℃) | Overall accuracy (%FS) |
| HK4041 | Standard | Medical | bridge output | 0.09 | gauge pressure | 40 | DIP | 8.5*8.5 | 0-80 | ±0.3 |
| HK4042 | Standard | Medical | bridge output | 0.09 | gauge pressure | 40 | DIP | 8.5*8.5 | 0-80 | ±0.3 |
| HK4043 | Standard | Medical | bridge output | 0.09 | gauge pressure | 40 | SOP | 7.0*7.0 | 0-80 | ±0.3 |
Message consultation