Electronic sphygmomanometer pressure sensor



1. Design and produce wafers using our U.S. invention patent SENSA process technology; 2. The wafer has high consistency and is divided into 6 gears according to offset and span. 3. The concentration of temperature characteristics is good, and the change of temperature range from 5 to 45 degrees is within 2mmHg. 4. Nonlinearity, pressure hysteresis and temperature hysteresis are all within 3 ‰. 5. Our company reuses the silicon wheat industry chain, which is localized in the whole industry chain and has high cost performance ratio.

Key words:

MEMS pressure sensor

Product Details


1, the use of our U.S. invention patent SENSA process technology design and production of wafers;

2. The wafer has high consistency and is divided into 6 gears according to offset and span;

3, the temperature characteristics of the concentration is good, 5 to 45 degrees of full temperature change within 2mmHg;

4, nonlinear, pressure hysteresis, temperature hysteresis are within 3;

5, reuse our silicon wheat industry chain, the whole industry chain localization, cost-effective.

Product Type:

Product Model Product promotion status Key Market Applications Output Type Output range (V) Pressure type Pressure range (kPA Encapsulation form Product size (length * width * height/m) Working temperature (℃) Overall accuracy (%FS)
HK4041 Standard Medical bridge output 0.09 gauge pressure 40 DIP 8.5*8.5 0-80 ±0.3
HK4042 Standard Medical bridge output 0.09 gauge pressure 40 DIP 8.5*8.5 0-80 ±0.3
HK4043 Standard Medical bridge output 0.09 gauge pressure 40 SOP 7.0*7.0 0-80 ±0.3

 

Message consultation