Dezhou manufacturing base full chain trial production success
Release time:
2023-09-25
Through debugging, the former Die Bond and Wire Bond equipment have fundamentally corrected the chip corner offset, crack, abnormal glue, gold wire collapse, gold ball offset and other undesirable phenomena. After verification, the chip shear force, gold wire pull, gold ball thrust have reached the standard, the chip yield has improved and remained stable at 99.8, in line with the industry standards.
Recently, the trial production of the packaging process at the Texas manufacturing base of Shandong Huake Semiconductor Research Institute Co., Ltd. was a one-time success.
Through debugging, the front-end Die Bond and Wire Bond equipment has fundamentally corrected undesirable phenomena such as chip corner deviation, cracks, glue abnormalities, gold wire collapse, and gold ball deviation. After verification, the chip shearing force, gold wire pulling force, and gold ball pushing force have all reached the standards. The chip yield has improved and remained stable at 99.8%, which is in line with industry standards.
The plastic sealing equipment, rib cutting and forming equipment, and laser printing equipment in the back-end workshop have been debugged and passed verification. After the plastic sealing process is completed, it is detected that there is no glue overflow, no bubbles on the surface, no patterns on the surface, no incomplete plastic sealing, no delamination, and no gold wire impact bending and other undesirable phenomena.
Through this equipment debugging and trial production, Shandong Huake Semiconductor Research Institute Co., Ltd. has opened up the final link of chip production and manufacturing, from wafer grinding and cutting, silver glue curing, gold wire welding, to injection molding, curing printing, electroplating and cutting. Then to finished product testing, it has reached the level of independently completing the entire chip manufacturing process, providing a strong competitive advantage for later expansion of domestic and international markets.
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Shandong Huake Semiconductor Research Institute Co., Ltd. visited Uzbekistan.
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On May 18, 2023, the "ASEAN Investment Promotion Conference-Entering Dezhou" hosted by the Dezhou Municipal People's Government, the Shandong Provincial Department of Commerce, and the Secretariat of the China-ASEAN Expo with the theme of "Sharing New Opportunities for RCEP, Talk about a New Future for Cooperation" The event was successfully opened. Vice Governor Wang Guiying, Governor of North Irogo Province of the Philippines Monnotok, Minister and Consul General of the Philippine Embassy in China Deng Talan, Minister Counsellor of the Thai Embassy in China Wantana Tadan, Deputy Director of the General Office of the Provincial Government Zheng Yaowu, Chairman of the Provincial Council for the Promotion of International Trade Meng Xiangdong, Deputy Director of the Foreign Affairs Office of the Provincial Party Committee Sun Yebao, Deputy Director Wang Hongping, Dezhou, Dezhou Municipal Party Committee Tian Weidong and other attended.
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The test equipment compatible with the three products has been successfully debugged and operated.
Compatible with HK6501/HK1001/HK1012 three models of product testing production equipment F23007 in the near future to the Dezhou production workshop and timely commissioning. Through the joint efforts of test engineers and technicians day and night, the problems existing in the key links of the equipment operation and control process including grasping and feeding, visual identification and pressing test have been solved, and the mechanical actions such as dividing and weaving have been operated smoothly. After analyzing, judging and repeatedly verifying the test results of HK6501 products, all the products have been tested correctly, and the equipment has realized the integrated, efficient and orderly operation from feeding, testing and weaving. In the future, the test of the remaining two products HK1001/HK1012 can be realized by replacing the corresponding test boards and test fixtures on the test equipment F23007 and loading the corresponding programs.
2023-09-25
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