Dezhou manufacturing base full chain trial production success
Release time:
2023-09-25
Through debugging, the former Die Bond and Wire Bond equipment have fundamentally corrected the chip corner offset, crack, abnormal glue, gold wire collapse, gold ball offset and other undesirable phenomena. After verification, the chip shear force, gold wire pull, gold ball thrust have reached the standard, the chip yield has improved and remained stable at 99.8, in line with the industry standards.
Recently, the trial production of the packaging process at the Texas manufacturing base of Shandong Huake Semiconductor Research Institute Co., Ltd. was a one-time success.
Through debugging, the front-end Die Bond and Wire Bond equipment has fundamentally corrected undesirable phenomena such as chip corner deviation, cracks, glue abnormalities, gold wire collapse, and gold ball deviation. After verification, the chip shearing force, gold wire pulling force, and gold ball pushing force have all reached the standards. The chip yield has improved and remained stable at 99.8%, which is in line with industry standards.
The plastic sealing equipment, rib cutting and forming equipment, and laser printing equipment in the back-end workshop have been debugged and passed verification. After the plastic sealing process is completed, it is detected that there is no glue overflow, no bubbles on the surface, no patterns on the surface, no incomplete plastic sealing, no delamination, and no gold wire impact bending and other undesirable phenomena.
Through this equipment debugging and trial production, Shandong Huake Semiconductor Research Institute Co., Ltd. has opened up the final link of chip production and manufacturing, from wafer grinding and cutting, silver glue curing, gold wire welding, to injection molding, curing printing, electroplating and cutting. Then to finished product testing, it has reached the level of independently completing the entire chip manufacturing process, providing a strong competitive advantage for later expansion of domestic and international markets.
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