HK2570M2


Category:


HK2570M2 based on a new generation of Intel®Xeon®Scalable processor build, maximum support TDP 150W CPU, and support 2 10.4 GT/s UPI interconnect links, so that the server has higher processing performance and lower power consumption. Support 16 2666 MT/s DDR4 ECC memory, memory support RDIMM,LRDIMM, support memory mirroring function and memory hot standby function, up to 1T memory capacity. Support 16 2.5-inch SATA, SAS hard disks or 4 3.5-inch SATA hard disks, support no more than 2 kinds of mix and match, support onboard SATA, support single power and 1 1 redundant power supply. With excellent performance, flexible expansion, stable and reliable characteristics. Users can flexibly configure according to the actual application to meet the needs of the evolving business application environment.

Key words:

tower server

Product Details


HK2570M2Based on a new generation of Intel ®Xeon ®Scalable processor build, maximum support TDP150W CPUand support 2 Article 10.4 GT/sUPI The interconnection link enables the server to have high processing performance andLower power consumption. Support 16 Article 2666 MT/s DDR4 ECCmemory, memory support RDIMM,LRDIMM,Support memory mirroring function and memory hot standby function, up 1T The memory capacity of. Support 16Block 2.5Inch SATA、SAS Hard disk or 4Block 3.5Inch SATA Hard disk, support no greater 2 Kind of mash-up, support onboard SATA, support singleElectricity and 1 1Redundant power supplies. With excellent performance, flexible expansion, stable and reliable characteristics. Users can according to the actual shouldFlexible configuration to meet the needs of the evolving business application environment.

Components Description
Processor

Processor Type:

Support for two Intel ®Skylake & cascadelake processors, which support processors with a maximum power of 150W, include processors that support power consumption points below 120W, and support low-voltage version processors. FPGA, Fabric, QAT function not supported

Chipset

Chipset Type:

Intel®C620 series chipset (Lewisburg-1G)

Memory

Memory type:

Support16 DIMM DDR4 Memory, eachCPU Supportmemory. SupportRDIMM, LRDIMMandNV DIMM (bar) memory type. Supportrank sparing, mirroring, lock step, ECC

I/O Interface

USB interface: front 2 USB3.0 interface, rear 2 USB3.0 interface, built-in 1 USB3.0 interface

Serial Interface: Rear 1 system serial port

VGA interface: rear 1 VGA connector

TPM interface: 1 TPMheader

Network data interface: 2 RJ45 network interface

management interface: integration 1 independent 1000Mbps network interface dedicated to remote management of IPMI

BMCReset button: Support BMC RST button

UID button: support UID Button

Display Controller

Controller Type:

AST2500 BMC chip, support IPMI2.0 Management function memory 32M

Hard disk

Hard Drive Type:

Front Window Support:

2.5 "x8, x16 hot-plug SAS, SATA, SSD drives

3.5 "x4 non-hot-plug SATA hard drive, non-hot-plug on-board configuration with direct cable to the motherboard

Power

Specifications: single power two: 500W, 1250W double power one: 500W 1 1 Redundancy

Power input: input are supported 100-240Vac

Physical Specifications

Packing box outside size: long 753mm, width 612mm, height 502mm

Host size: 650mm * 210mm * 425mm

Product weight: full

Gross weight: 32kg (gross weight includes: host packing box accessories box

Environmental parameters

Working environment temperature: 10 ℃ -35℃

Storage and transportation temperature:-40 ℃ -60℃

Working humidity: 20% -80% relative humidity

Storage and transportation humidity:20% -93%(40 ℃) relative humidity

 

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