LGA Package Pressure Module



The absolute pressure module is a unique LGA packaged pressure chip module. Its MEMS chip is prepared by the SENSA process independently developed and equipped with an application-specific integrated circuit conditioning chip. It has the advantages of high precision, good stability, excellent temperature compensation, etc. It can be packaged into the required pressure sensor form according to customer requirements to realize the calibration of specific proportional output signals. This series of products in the compensation temperature range (-40°C to 125°C), the full range of the accuracy of less than ± 2.0. The differential pressure module is a high-stability micro-differential pressure chip module based on LGA package of ceramic materials. Its MEMS chip is prepared by advanced all-silicon pressure sensor technology commonly used in the world, and is equipped with a special integrated circuit conditioning chip. It has the advantages of high precision, good stability, excellent temperature compensation, etc. It can be packaged into the required pressure sensor form according to customer requirements to realize calibration of specific proportional output signals. This series of products in the compensation temperature range (-40°C to 125°C), the full range of accuracy is less than ± 3.0

Key words:

MEMS pressure sensor

Product Details


The absolute pressure module is a unique LGA packaged pressure chip module. Its MEMS chip is prepared by the SENSA process independently developed and equipped with an application-specific integrated circuit conditioning chip. It has the advantages of high precision, good stability, excellent temperature compensation, etc. It can be packaged into the required pressure sensor form according to customer requirements to realize the calibration of specific proportional output signals. This series of products in the compensation temperature range (-40°C to 125°C), the full range of the accuracy of less than ± 2.0. The differential pressure module is a high-stability micro-differential pressure chip module based on LGA package of ceramic materials. Its MEMS chip is prepared by advanced all-silicon pressure sensor technology commonly used in the world, and is equipped with a special integrated circuit conditioning chip. It has the advantages of high precision, good stability, excellent temperature compensation, etc. It can be packaged into the required pressure sensor form according to customer requirements to realize calibration of specific proportional output signals. This series of products in the compensation temperature range (-40°C to 125°C), the full range of accuracy is less than ± 3.0

Technical parameters:

 

Product Type Product promotion status Key Market Applications Output Type Output range (V) Pressure type Pressure range (kPA Encapsulation form Product size (length * width * height/mm) Working temperature (℃) Overall accuracy (%FS)
HK4063 Standard (customizable) Car Analog output 0.5-4.5 Differential pressure 100 LGA 4.72*3.76 -40~125 ±2
HK4064 Standard (customizable) Car Analog output 0.5-4.5 Differential pressure 25 LGA 4.72*3.76 -40~125 ±2
HK4065 Standard (customizable) Car Analog output 0.5-4.5 absolute pressure 100 LGA 4.72*3.76 -40~125 ±2
HK4066 Standard (customizable) Car Analog output 0.5-4.5 absolute pressure 300 LGA 4.72*3.76 -40~125 ±2
HK4067 Standard (customizable) Car Analog output 0.5-4.5 absolute pressure 700 LGA 4.72*3.76 -40-125 ±2

 

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