MEMS pressure sensor-COB package absolute pressure module-Huake

MEMS pressure sensor-COB package absolute pressure module

Category:

MEMS pressure sensors can use SOP packaged absolute pressure modules. Its MEMS chip uses Pt-Au Pad and wiring, which has strong corrosion resistance and can work in harsh exhaust gas environments. The product uses a ceramic base, a PPS upper cover, and is filled with perfluorinated gel, which can effectively protect the internal chip from corrosive gas erosion and greatly increase reliability. The unique COB packaging design can effectively protect solder joints and can be flexibly matched with client packaging to provide solutions suitable for client applications.

Key words:

Pressure sensor series

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Product Details

MEMS pressure sensors can use SOP packaged absolute pressure modules. Its MEMS chip uses Pt-Au Pad and wiring, which has strong corrosion resistance and can work in harsh exhaust gas environments. The product uses a ceramic base, PPS upper cover, and is potted with perfluorogel, which can effectively protect the internal chip from corrosive gas erosion and greatly increase reliability. The unique COB packaging design can effectively protect solder joints and can be flexibly matched with client packaging to provide solutions suitable for client applications.

Product Features:
♦ Wide range: -100 kPaG~100 kPaG
♦ Pressure response time is better than 0.8ms
♦ AEC-Q100 certified
♦ Output clamp can be customized
♦ High precision:

± 1% FS @0 ℃ ~85 ℃,
± 1.5% FS @-40℃ ~130 ℃

　♦ Wide temperature range: -40 ℃ ~ 130 ℃

　♦ Overvoltage 28V, reverse connection 24V

　♦ Absolute/proportional/SENT output

　♦ Ceramic substrate flip-chip welding design to effectively achieve anti-corrosion packaging

Technical parameters:

应用场景：
　　♦ VBS
　　♦DPS
　　♦ EVAP
　　♦ Crank Case

Pressure sensor series